Below is the critical pinout for UFS 3.1 operation. Balls are named by row (A..M) and column (1..13). Top view (ball side down, looking through package).
| Ball | Signal | Type | Description | |------|--------|------|-------------| | A1 | VCC | Power | NAND flash core power (2.5V - 3.6V, typically 3.3V) | | A2 | VCC | Power | Same as A1 – connect together | | A4 | REF_CLK | Input | Reference clock (26 MHz typical, 19.2 / 38.4 MHz possible) | | A5 | RST_N | Input | Hardware reset (active low, internal pull-up) | | B1 | VCC | Power | NAND core power | | B2 | VCC | Power | NAND core power | | B3 | C/D | Input | Configuration / Boot mode. Pull high (VCCQ) for normal boot, low for test modes. | | B4 | VSS | Ground | Ground | | B5 | VSS | Ground | Ground | | C1 | VCCQ | Power | Controller I/O & logic (1.14V - 1.26V typical 1.2V) | | C2 | VCCQ | Power | Same as C1 | | C3 | D0_RX | Input | Lane 0 – Receiver differential input (from host) | | C4 | D0_TX | Output | Lane 0 – Transmitter differential output (to host) | | D3 | D1_RX | Input | Lane 1 – Receiver differential input | | D4 | D1_TX | Output | Lane 1 – Transmitter differential output | | D5 | VSS | Ground | Ground | | E1 | VCCQ2 | Power | Optional second I/O supply (1.8V or 2.5V). If unused, tie to VCCQ or leave NC. | | ... (center balls omitted) | ... | ... | Most balls in rows E–J / cols 3–10 are reserved or not connected | | L2 | VSS | Ground | Ground | | M1 | VSS | Ground | Ground |
Note: Many central balls (e.g., row F–J) are NC (No Connect). Do not ground them – they may be test points or unused.
The 153 balls are arranged in a 13x13 grid, but many center balls are omitted or reserved. The key functional groups:
| Group | Balls | Description | |-------|-------|-------------| | Power | A1, A2, B1, B2, etc. | VCC (NAND), VCCQ (I/O & Controller), VCCQ2 (optional 1.8V) | | Ground | Multiple | VSS | | UFS Interface | C3, C4, D3, D4 | D0_RX, D0_TX, D1_RX, D1_TX (two lanes) | | Control | A4, A5 | REF_CLK, RST_N | | Boot/Init | B3 | C/D (Boot mode / configuration) |
Always use the exact module datasheet and reference design; UFS physical pinouts and required rails are vendor-specific. For implementation, base your PCB and power sequencing on the manufacturer’s documents.
(Note: I can make a sample 2-lane BGA pin map and PCB routing checklist if you want a concrete pin diagram for a typical UFS 3.1 2-lane module — say yes and tell me target module/vendor or accept a generic example.)
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standard (JESD220E) typically uses a 153-ball BGA (Ball Grid Array) package, similar to previous UFS generations like 2.1 and 3.0, but with updated electrical specifications for higher speeds. Key Signals and Power Rails
UFS 3.1 utilizes a differential serial interface (M-PHY) with up to two lanes for data transfer. Mouser Electronics Data Lanes (Differential Pairs): DIN_t / DIN_c: Input data lanes (Host to Device). DOUT_t / DOUT_c: Output data lanes (Device to Host). Power Supplies: VCC (2.7V – 3.6V): Main power for the NAND flash media. VCCQ (1.14V – 1.26V): Power for the UFS controller and I/O interface. VCCQ2 (1.7V – 1.95V):
Typically used for the M-PHY layer or other low-voltage internal modules. Control Signals:
Reference clock input (square wave, single-ended), critical for High-Speed (HS) modes. Hardware reset signal (active low). Mouser Electronics Pin Assignment Groups (153-Ball BGA)
While the full 153-ball map contains many ground (GND) and "No Connect" (NC) pins, the critical functional pins are clustered as follows: Core Voltage
Typically multiple pins (e.g., A3, B3, C3) for current capacity. I/O Voltage Low voltage rail (1.2V typical). PHY Voltage Mid-range voltage rail (1.8V typical). Transmit Pairs
Differential output signals from host view (DIN for device). Receive Pairs ufs 3.1 pinout
Differential input signals from host view (DOUT for device). Reference Clock Necessary for HS-G3 and HS-G4 modes. System reset pin. In-System Programming (ISP) Points
For data recovery or forensic tasks, "ISP" refers to soldering directly to specific test points on a PCB rather than the full BGA grid. Common ISP connections for UFS 3.1 include: VCC & VCCQ TX0_P/N & RX0_P/N (Data Lane 0) Some UFS 3.1 implementations require a 10-ohm resistor
on the TX line to ground to enable communication with certain flasher boxes. ball-by-ball map
for a specific package size, such as the 11.5mm x 13mm variant?
JEDEC Publishes Update to Universal Flash Storage (UFS) Standard 30 Jan 2020 —
UFS 3.1 introduces new features intended to help maximize device performance while minimizing power usage. 153-Ball Automotive UFS Memory - Mouser Electronics
Universal flash storage (UFS) controller and NAND. Differential I/O pins. – 2 lanes supported. – High speed: Gear 1/2/3 supported. Mouser Electronics
UFS 3.1协议分析(第六章) -- UFS电气信号 - CSDN博客 22 Sept 2021 —
UFS信号 UFS供电 复位 参考时钟. UFS有三个供电电压,分别是VCC、VCCQ、VCCQ2。 ufs3.1中规定的电压值范围为: VCC从300mV上升到2.4V / 2.7V时间为35ms. CSDN博客 UNIVERSAL FLASH STORAGE (UFS 3.1)
* Deep Sleep(mA) VCCQ(1.2V) VCC(2.5V) VCCQ(1.2V) 537. 124. 439. 0.36. 0.05. 0.15. 0.06. „Mouser Electronics“ Lietuva Samsung UFS Card 7 Apr 2016 —
You're looking for information on the pinout of UFS 3.1!
UFS 3.1 (Universal Flash Storage 3.1) is a high-speed storage interface standard designed for mobile devices, such as smartphones, tablets, and laptops. It provides faster data transfer rates, lower power consumption, and higher storage capacity compared to its predecessors.
The UFS 3.1 interface uses a MIPI (Mobile Industry Processor Interface) M-PHY physical layer, which is a high-speed, low-power interface standard. The UFS 3.1 pinout consists of:
UFS 3.1 Pinout:
The UFS 3.1 interface supports multiple lanes, with each lane capable of operating at speeds of up to 2.9 Gbps (gigabits per second). The standard also supports multiple configurations, including:
The UFS 3.1 pinout is designed to be compatible with a wide range of applications, including smartphones, tablets, laptops, and other mobile devices.
Do you have any specific questions about the UFS 3.1 pinout or its applications?
Universal Flash Storage (UFS) 3.1 is the high-performance storage standard designed for the 5G era, offering significant speed and power efficiency improvements over previous generations. Understanding its pinout is critical for hardware engineers and developers tasked with integrating this storage into mobile, automotive, and AR/VR systems. The Core Architecture: Low Pin Count, High Speed
Unlike the parallel interface used in older eMMC standards, UFS 3.1 utilizes a serial interface based on the MIPI M-PHY and UniPro specifications. This design choice allows for a significantly lower pin count, which simplifies PCB routing and reduces the physical footprint on space-constrained mobile motherboards.
The physical interface typically resides in a 153-ball BGA (Ball Grid Array) package, which is standard for high-density flash storage. Key Functional Pin Categories
The UFS 3.1 pinout is strategically organized into three primary functional groups: data transmission, power supply, and control/clocking. High-Speed Data Lanes (M-PHY):
TX_DP/TX_DN: Differential transmit pairs for data sent from the host to the UFS device.
RX_DP/RX_DN: Differential receive pairs for data sent from the device to the host.
UFS 3.1 supports dual-lane operation, meaning it can utilize two sets of these differential pairs to double its bandwidth, reaching sequential read speeds up to 2,100 MB/s. Power Supply Pins:
VCC: The main power supply for the NAND flash memory, typically operating at 2.5V or 3.3V.
VCCQ: The power supply for the UFS controller and I/O interface, usually 1.2V.
VCCQ2: An additional supply used in some configurations for low-voltage interface operations. Reference Clock and Control:
REF_CLK: A square wave single-ended reference clock input. While UFS can operate without this in low-speed modes (using self-clocked PWM signaling), the reference clock is required for High-Speed (HS) modes to ensure low bit-error rates and fast PLL locking. RST_N: A hardware reset pin used to initialize the device. Hardware Integration and Signal Integrity Below is the critical pinout for UFS 3
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global
Universal Flash Storage (UFS) 3.1 is a high-performance storage interface standard commonly used in modern smartphones and automotive systems to provide high-speed data transfer and improved power efficiency. Common UFS 3.1 Pinout Configurations
UFS 3.1 chips typically use a Ball Grid Array (BGA) package, with the most common being BGA 153 and BGA 254. 1. BGA 153 Pinout (Standard Mobile/Embedded)
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global. samsung.com
UFS 3.1 typically utilizes a BGA 153 (153-ball) package with an 11.5mm x 13.0mm footprint. Unlike the parallel interface of eMMC, UFS uses a serial differential interface (MIPI M-PHY) to achieve significantly higher speeds—over 1,500 MB/s for UFS 3.1. ⚡ Critical Signal Groups
The UFS 3.1 interface is categorized into power, high-speed differential data, and control lines. Signal Type Description Data (Transmit) TXP, TXN Differential transmit pair (Host to Device) Data (Receive) RXP, RXN Differential receive pair (Device to Host) Control RST_N, REF_CLK
Reset signal and Reference Clock for high-speed synchronization Power (Core) VCC Primary supply voltage (typically 2.5V – 3.3V) Power (I/O) VCCQ, VCCQ2
I/O supply voltages (typically 1.2V for VCCQ and 1.8V for VCCQ2) 🔍 ISP (In-System Programming) Pinout
For data recovery or forensic chip-off/ISP work, five primary wires are usually required to establish communication with tools like EasyJtag or UFI: TXP / TXN: Data transmission pairs. RXP / RXN: Data reception pairs. GND: Ground connection.
RST: Reset (often required for stable detection on newer chips).
Note: For ISP, power is often supplied via the device's USB port (battery connected) rather than external VCC wires to avoid current supply issues. UFS | eStorage | Samsung Semiconductor Global
Its expanded capacity and enhanced endurance support diverse automotive workloads. * Interface. G4 2Lane. * Package Size. 11.5x13. samsung.com UNIVERSAL FLASH STORAGE (UFS 3.1) - Mouser Electronics
This guide summarizes the common UFS (Universal Flash Storage) 3.1 BGA/module pinout conventions and signal descriptions for system designers. Assume typical mobile-device connector or BGA module mapping; exact pin names and positions depend on vendor/module footprint — always consult the module/datasheet for final layout and electrical details. Note : Many central balls (e
If C/D ball is high, device boots from logical unit 0 (normal). If low, enters pre-soldering test mode (do not use in product).
If you are designing a circuit, debugging a non-functional phone, or attempting data recovery, focus on these five pins first: